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Article: Thermo-mechanical analysis of advanced electronic packages in early system design
Journal: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems [0946-7076]
Author: Sommer, Johann-Peter
Year: 2005
Volume: 12
Issue: 1-2
Pages: 75 - 81
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Springer Journals (NERL)
From 1997, volume 3: issue 1
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