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Article:   Thermo-mechanical analysis of advanced electronic packages in early system design

Journal:   Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems   [0946-7076]

Author:   Sommer,  Johann-Peter
Year:  2005     Volume:  12     Issue:  1-2     Pages:  75 - 81

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Springer Journals (NERL)
From 1997, volume 3: issue 1

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