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Article:   Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS

Journal:   Journal of Electronic Materials   [0361-5235]

Author:   KPOBIE, W
Year:  2014     Volume:  43     Issue:  3     Pages:  671 - 684

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From 1997, volume 26: issue 1
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